Method and apparatus for purging and plasma suppression in a process chamber
US9399228B2 · kind B2 · utility
411Cited by
34References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2013 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Oct 20, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing system includes a showerhead that comprises a head portion and a stem portion and that delivers precursor gas to a processing chamber. A baffle includes a base portion having an outer diameter that is greater than an outer diameter of the head portion of the showerhead, that comprises a dielectric material and that is arranged between the head portion of the showerhead and an upper surface of the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.