Inventor · Beaverton, OR, US

Pramod Subramonium

34Patents
15h-index
59Co-inventors
80Inventor score

Filing activity: Dec 23, 2005 → Jul 13, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8956983B2 Conformal doping via plasma activated atomic layer deposition and conformal film deposition Electricity 572 Active
US7381644B1 Pulsed PECVD method for modulating hydrogen content in hard mask Emerging Cross-Sectional Technologies 520 Expired
US8591659B1 Plasma clean method for deposition chamber Electricity 518 Active
US9399228B2 Method and apparatus for purging and plasma suppression in a process chamber Emerging Cross-Sectional Technologies 411 Active
US8637411B2 Plasma activated conformal dielectric film deposition Electricity 95 Active
US8999859B2 Plasma activated conformal dielectric film deposition Electricity 55 Active
US7915166B1 Diffusion barrier and etch stop films Electricity 53 Active
US8435608B1 Methods of depositing smooth and conformal ashable hard mask films Electricity 46 Active
US7981810B1 Methods of depositing highly selective transparent ashable hardmask films Electricity 40 Active
US8110493B1 Pulsed PECVD method for modulating hydrogen content in hard mask Electricity 33 Active
US8669181B1 Diffusion barrier and etch stop films Electricity 32 Active
US7906817B1 High compressive stress carbon liners for MOS devices Electricity 31 Active
US9570274B2 Plasma activated conformal dielectric film deposition Electricity 29 Active
US7981777B1 Methods of depositing stable and hermetic ashable hardmask films Electricity 28 Active
US10043655B2 Plasma activated conformal dielectric film deposition Electricity 23 Active
US8741394B2 In-situ deposition of film stacks Electricity 15 Active
US8288292B2 Depositing conformal boron nitride film by CVD without plasma Electricity 12 Active
US9153482B2 Methods and apparatus for selective deposition of cobalt in semiconductor processing Electricity 11 Active
US9633896B1 Methods for formation of low-k aluminum-containing etch stop films Electricity 10 Active
US8268722B2 Interfacial capping layers for interconnects Electricity 10 Active
US8962101B2 Methods and apparatus for plasma-based deposition Electricity 6 Active
US9589799B2 High selectivity and low stress carbon hardmask by pulsed low frequency RF power Electricity 6 Active
US9028924B2 In-situ deposition of film stacks Electricity 6 Active
US9240320B1 Methods of depositing smooth and conformal ashable hard mask films Electricity 5 Active
US10214816B2 PECVD apparatus for in-situ deposition of film stacks Electricity 4 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.