Substrate processing with reduced warpage and/or controlled strain
US9401277B2 · kind B2 · utility
1Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2013 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Dec 21, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided are systems and methods for processing the surface of substrates that scan a laser beam at one or more selected orientation angles. The orientation angle or angles may be selected to reduce substrate warpage. When the substrates are semiconductor wafers having microelectronic devices, the orientation angles may be selected to produce controlled strain and to improve electronic performance of the devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.