Adaptive patterning for panelized packaging
US9418905B2 · kind B2 · utility
7Cited by
18References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2013 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Apr 2, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adaptive patterning method and system for fabricating panel based package structures is described. Misalignment for individual device units in a panel or reticulated wafer may be adjusted for by measuring the position of each individual device unit and forming a unit-specific pattern over each of the respective device units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.