Patent · US Active

Stacked silicon package assembly having enhanced lid adhesion

US9418909B1 · kind B1 · utility

14Cited by

5References

19Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Raghunandan Chaware · Mountain View, US
Inderjit Singh · Saratoga, US

Key dates

Filing date	Aug 6, 2015
Grant date	Aug 16, 2016
Priority date	—
Expiry date	Aug 6, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16196
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and apparatus are provided which improve the adhesion of a lid to an IC die of an IC (chip) package. In one embodiment, a chip package assembly is provided that includes an IC die, a package substrate and a lid. The IC die is coupled to the package substrate. The lid has a first surface and a second surface. The second surface of the lid faces away from the first surface and towards the IC die. The second surface of the lid has a plurality of engineered features. The adhesive couples the plurality of engineered features of the lid to the IC die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.