Patent · US Active

Manufacturing a flexible structure by transfers of layers

US9427948B2 · kind B2 · utility

4Cited by
1References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 18, 2012
Grant dateAug 30, 2016
Priority date
Expiry dateDec 30, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24967
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method for manufacturing a flexible structure including implanting ionic species in first and second source substrates so as to form first and second embrittlement regions respectively, delimiting first and second thin films, providing a flexible substrate, the stiffness R of which is less than or equal to 107 GPa·μm3, securing the first and second thin films to the first and second faces of the flexible substrate respectively so as to form a stack including the flexible structure delimited by the first and second embrittlement regions, the flexible structure having a stiffening effect suitable for allowing transfers of the first and second thin films, and applying a thermal budget so as to transfer the first and second thin films onto the flexible substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.