Wafer encapsulated microelectromechanical structure
US9434608B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2014 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Nov 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while the second portion of the substrate is disposed at least partly within the cavity and constitutes a first portion of an electrical contact. A second substrate is secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure. The second substrate has a first portion that constitutes a second portion of the electrical contact and is disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.