Heat spreading layer with high thermal conductivity
US9437515B2 · kind B2 · utility
5Cited by
11References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2015 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Aug 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.