Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
US9449912B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 11, 2015 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Jun 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) module for an IC card includes a plurality of IC card contacts in side-by-side relation. A dielectric support layer is above the contact layer and has a plurality of openings and a first coefficient of thermal expansion (CTE). An IC die is above the dielectric support layer and includes a plurality of bond pads. A bond wire extends from a respective bond pad to a corresponding contact through an adjacent opening in the dielectric support layer. A respective body of fill material is within each opening and has a second CTE. A mold compound body is above the dielectric support layer, the bodies of fill material, and surrounding the IC die. The mold compound body has a third CTE. The first CTE is closer to the second CTE than to the third CTE.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.