Patent · US Active

Semiconductor devices and processing methods

US9455205B2 · kind B2 · utility

3Cited by

6References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Markus Zundel · Egmating, DE
Franz Hirler · Isen, DE
Peter Nelle · Munich, DE
Ludger Borucki · Munich, DE
Markus Winkler · Munich, DE
Erwin Vogl · Hallbergmoos, DE

Key dates

Filing date	Oct 17, 2013
Grant date	Sep 27, 2016
Priority date	—
Expiry date	Mar 8, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for processing a semiconductor device in accordance with various embodiments may include: providing a semiconductor device having a first pad and a second pad electrically disconnected from the first pad; applying at least one electrical test potential to at least one of the first pad and the second pad; and electrically connecting the first pad and the second pad to one another after applying the at least one electrical test potential.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.