Thermal pyrolytic graphite shadow ring assembly for heat dissipation in plasma chamber
US9478455B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2015 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Jun 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68377
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a shadow ring assembly for a plasma processing chamber includes an annular body including a thermally conductive material. The annular body includes a top surface to face an interior of the plasma chamber, and a bottom surface to face a substrate carrier in the plasma chamber. A plurality of posts are attached to the annular body and positioned substantially below the bottom surface of the annular body. Each of the plurality of posts includes an inner core of thermal pyrolytic graphite (TPG). The shadow ring assembly also includes a plasma resistant coating on the annular body and the plurality of posts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.