Surface annealing of components for substrate processing chambers
US9481608B2 · kind B2 · utility
4Cited by
325References
20Claims
0Family size
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Key dates
| Filing date | Nov 22, 2013 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | May 29, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a processing chamber component comprises forming a processing chamber component having a structural body with surface regions having microcracks, and directing a laser beam onto the microcracks of the surface regions of the structural body for a sufficient time to heal and close off the microcracks by themselves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.