Package-on-package structure with reduced height
US9484327B2 · kind B2 · utility
4Cited by
5References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Mar 15, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To achieve a package-on-package having an advantageously reduced height, a first package substrate has a window sized to receive a second package die. The first package substrate interconnects to the second package substrate through a plurality of package-to-package interconnects such that the first and second substrates are separated by a gap. The second package die has a thickness greater than the gap such that the second package die is at least partially disposed within the first package substrate's window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.