Pattern evaluation method and pattern evaluation device
US9488815B2 · kind B2 · utility
2Cited by
1References
16Claims
0Family size
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Key dates
| Filing date | Jan 30, 2013 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Mar 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An pattern evaluation method includes a step of estimating imaging deviation allowed to evaluate an overlay position on one or more evaluation point candidates based on pattern layout information, a step of deciding one or more evaluation points from among the evaluation point candidates based on the allowed imaging deviation, a step of deciding an imaging sequence for imaging the selected evaluation point, and a step of evaluating an overlay position between first and second patterns based on an image obtained by imaging the evaluation point according to the imaging sequence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.