Electronic device with multi-layer contact
US9490193B2 · kind B2 · utility
1Cited by
0References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2011 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Dec 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/17747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The electronic device includes a carrier, a semiconductor substrate attached to the carrier, and a layer system disposed between the semiconductor substrate and the carrier. The layer system includes an electrical contact layer disposed on the semiconductor substrate. A functional layer is disposed on the electrical contact layer. An adhesion layer is disposed on the functional layer. A solder layer is disposed between the adhesion layer and the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.