Patent · US Active

Electronic device with multi-layer contact

US9490193B2 · kind B2 · utility

1Cited by
0References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 1, 2011
Grant dateNov 8, 2016
Priority date
Expiry dateDec 3, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/17747
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The electronic device includes a carrier, a semiconductor substrate attached to the carrier, and a layer system disposed between the semiconductor substrate and the carrier. The layer system includes an electrical contact layer disposed on the semiconductor substrate. A functional layer is disposed on the electrical contact layer. An adhesion layer is disposed on the functional layer. A solder layer is disposed between the adhesion layer and the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.