Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs
US9502275B1 · kind B1 · utility
8Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2015 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Oct 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.