3D integrated circuit package processing with panel type lid
US9502383B2 · kind B2 · utility
6Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Jun 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Presented herein is a package comprising a carrier device of a device stack and at least one top device of the device stack mounted on a first side of the carrier device. A lid is mounted on the first side of the carrier device, with a first portion of the lid attached to the carrier device and a second portion of the lid extending past and overhanging a respective edge of the carrier device. The lid comprises a recess disposed in a first side, and the at least one top device is disposed within the recess. A thermal interface material disposed on the top device and contacts a surface of the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.