Method and apparatus for assisted metal routing
US9519745B2 · kind B2 · utility
5Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2014 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Oct 24, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/394
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for an assisted metal routing is disclosed. Embodiments may include: determining an initial block mask having a first inner vertex for forming a metal routing layer of an integrated circuit (IC); adding an assistant metal portion within the metal routing layer; and determining a modified block mask based on the assistant metal portion for forming the metal routing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.