Front side package-level serialization for packages comprising unique identifiers
US9520364B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2015 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Aug 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor device can include providing a plurality of semiconductor die, wherein each semiconductor die comprises an active surface and a backside opposite the active surface. The method can include forming a build-up interconnect structure that extends over the active surface of each of the plurality of semiconductor die within the wafer, and forming a unique identifying mark for each of the plurality of semiconductor die as part of a layer within the build-up interconnect structure while simultaneously forming the layer of the build-up interconnect structure. The layer of the build-up interconnect structure can comprise both the unique identifying marks for each of the plurality of semiconductor die and functionality for the semiconductor device. Each unique identifying mark can convey a unique identity of its respective semiconductor die. The method can further include singulating the plurality of semiconductor die into a plurality of semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.