Method of making a resistive random access memory
US9520562B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2014 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Jul 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/8833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosed technology generally relates to semiconductor devices, and relates more particularly to resistive random access memory devices and methods of making the same. In one aspect, a method of forming a resistive random access memory cell of a random access memory device includes forming a first electrode and forming a resistive switching material comprising an oxide of a pnictogen element by atomic layer deposition. The method additionally includes forming a metallic layer comprising the pnictogen element by atomic layer deposition (ALD). The resistive switching material is interposed between the first electrode and the metallic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.