Patent · US Active

Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

US9539695B2 · kind B2 · utility

2Cited by

11References

26Claims

0Family size

Assignees

Siltronic AG · DE
Peter Wolters GmbH · DE

Inventors

Georg Pietsch · Burghausen, DE
Michael Kerstan · Burghausen, DE
Heiko aus dem Spring · Hamburg, DE

Key dates

Filing date	Oct 1, 2008
Grant date	Jan 10, 2017
Priority date	—
Expiry date	Oct 12, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Carriers suitable for receiving one or more semiconductor wafers for the machining thereof in lapping, grinding or polishing machines, comprise a core of a first material which has a high stiffness, the core being completely or partly coated with a second material, and also at least one cutout for receiving a semiconductor wafer, wherein the second material is a thermoset polyurethane elastomer having a Shore A hardness of 20-90. The carriers are preferably coated with the second material after chemical surface activation and application of adhesion promoter, and may be used for simultaneous double-side material-removing machining of a plurality of semiconductor wafers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.