Apparatus and method for removing challenging polymer films and structures from semiconductor wafers
US9541837B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2013 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Jul 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present apparatus and method are configured to remove challenging polymer films and structures from semiconductor wafers. This technique involves the use of a double soak and spray sequence with unique parameters and can be varied depending upon the application. The initial immersion step is used to initiate the swelling and dissolution of the polymer. The first spray step may include a high pressure needle to pierce through the top layer allowing more solvent to penetrate in the subsequent soak process. The second immersion can then penetrate further and faster allowing substantial penetration of the polymer by the solvent. The final high pressure spray proceeds to remove all of the polymer coating. The process ends with a final rinse and dry sequence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.