Wafer level packages with mechanically decoupled fan-in and fan-out areas
US9543277B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2015 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Aug 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fan-out microelectronic package is provided in which bond wires electrically couple bond pads on a microelectronic element, e.g., a semiconductor chip which may have additional traces thereon, with contacts at a fan-out area of a dielectric element adjacent an edge surface of the chip. The bond wires mechanically decouple the microelectronic element from the fan-out area, which can make the electrical interconnections less prone to reliability issues due to effects of differential thermal expansion, such as caused by temperature excursions during initial package fabrication, bonding operations or thermal cycling. In addition, mechanical decoupling provided by the bond wires may also remedy other mechanical issues such as shock and possible delamination of package elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.