Semiconductor package with integrated magnetic field sensor

US9564578B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thorsten Meyer · Regensburg, DE
• Martin Gruber · Schwandorf, DE
• Rainer Markus Schaller · Kelheim, DE
• Franz Jost · Stuttgart, DE
• Stefan Mieslinger · Kottgeisering, DE
• Liu Chen · Munich, DE
• Toni Salminen · Munich, DE
• Giuliano Angelo Babulano · Ottobrunn, DE
• Jens Oetjen · Borgo San Lazzaro, DE
• Markus Dinkel · Unterhaching, DE

Key dates

• Filing date: Nov 20, 2015
• Grant date: Feb 7, 2017
• Expiry date: Nov 20, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1815
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.