Packages with thermal interface material on the sidewalls of stacked dies
US9583415B2 · kind B2 · utility
21Cited by
27References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2013 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Nov 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package includes a die stack that includes at least two stacked dies, and a Thermal Interface Material (TIM). The TIM includes a top portion over and contacting a top surface of the die stack, and a sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies. A first metallic heat-dissipating feature is over and contacting the top portion of TIM. A second metallic heat-dissipating feature has a sidewall contacting a sidewall of the sidewall portion of the TIM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.