Methods of forming low noise semiconductor devices
US9583595B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2015 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Sep 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2658
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are Lateral Diffused Metal Oxide Semiconductor (LDMOS) device and trench isolation related devices, methods, and techniques. In one illustration, a doped region is formed within a semiconductor substrate. A trench isolation region is formed within the doped region. The doped region and the trench isolation region are part of a Lateral Diffused Metal Oxide Semiconductor (LDMOS) device. The trench isolation region or an interface between the trench isolation region and the doped region is configured to reduce low frequency noise in the LDMOS device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.