Method for producing a directional layer by cathode sputtering, and device for implementing the method
US9587306B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2008 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Sep 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3447
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
For producing a directional layer for instance with constant nominal directionality, such as a low-retentivity layer with a preferred direction of magnetization or a support layer for such a layer by cathode sputtering on a substrate surface (4), the coating process takes place in a manner whereby particles emanating from a target surface (6) impinge predominantly from directions whose projections onto the substrate surface (4) lies within a preferred angular range surrounding the nominal direction. This is achieved for instance by positioning a collimator (8), encompassing plates (9) that extend at a normal angle to the substrate surface (4) parallel to the nominal direction in front of the substrate surface (4), but in lieu of or in addition to such positioning the location or movement of the substrate surface (4) relative to the target surface (6) can also be suitably adjusted or controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.