Patent · US Active

Electronic module and method of manufacturing the same

US9589922B2 · kind B2 · utility

3Cited by

0References

5Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Christian Neugirg · Regensburg, DE
Andreas Grassmann · Villach, AT
Wolfram Hable · Dresden, DE
Ottmar Geitner · Pentling, DE
Frank Winter · Mühlheim, DE
Alexander Schwarz · Soest, DE
Inpil Yoo · Unterhaching, DE

Key dates

Filing date	Mar 16, 2014
Grant date	Mar 7, 2017
Priority date	—
Expiry date	Dec 5, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.