Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9597769B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2012 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Oct 25, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.