Method of fabricating a polishing
US9597770B2 · kind B2 · utility
0Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2014 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Mar 24, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.