Homogeneous polishing pad for eddy current end-point detection
US9597777B2 · kind B2 · utility
0Cited by
46References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2014 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Apr 27, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/205
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.