Test probe substrate

US9606142B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Bing Dang · Chappaqua, US
• John U. Knickerbocker · Wappingers Falls, US
• Jae-Woong Nah · Closter, US
• Robert E. Trzcinski · Rhinebeck, US
• Cornelia K. Tsang · Potsdam, US

Key dates

• Filing date: Sep 24, 2014
• Grant date: Mar 28, 2017
• Expiry date: Jan 6, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/014
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.