Electronic device with heat dissipater
US9620438B2 · kind B2 · utility
3Cited by
3References
23Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 6, 2015 |
| Grant date | Apr 11, 2017 |
| Priority date | — |
| Expiry date | Feb 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes an integrated circuit chip mounted to a heat slug. The heat slug has a peripheral region having first thickness along a first direction, the peripheral region surrounding a recess region (having a second, smaller, thickness along the first direction) that defines a chip mounting surface along a second direction perpendicular to the first direction. The recess region defines side borders and a nook extends into the heat slug along the side borders. An insulating body embeds the integrated circuit one chip and heat slug. Material of the insulating body fills the nook.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.