Semiconductor chip with thermal interface tape
US9627281B2 · kind B2 · utility
0Cited by
3References
16Claims
0Family size
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Key dates
| Filing date | Aug 20, 2010 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Jan 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing is provided that includes applying a thermal interface tape to a side of a semiconductor wafer that includes at least one semiconductor chip. The thermal interface material tape is positioned on the at least one semiconductor chip. The at least one semiconductor chip is singulated from the semiconductor wafer with at least a portion of the thermal interface tape still attached to the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.