Split ball grid array pad for multi-chip modules

US9633914B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Anson J. Call · Poughkeepsie, US
• Erwin B. Cohen · Durham, US
• Dany Minier · Granby, CA
• Wolfgang Sauter · Avon, US
• David B. Stone · Williamsport, US
• Eric W. Tremble · Jericho, US

Key dates

• Filing date: Sep 15, 2015
• Grant date: Apr 25, 2017
• Expiry date: Sep 15, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/16152
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pads on the top surface of the substrate and second pads on the bottom surface of the substrate; a first active component attached to a first group of the first pads and a second active component attached to a second group of the first pads; wherein at least one pad of the second pads is a split pad having a first section and a non-contiguous second section separated by a gap, the first section connected by a first wire of the multiple wires to a pad of the first group of first pads and the second section is connected by a second wire of the multiple wires to a pad of the second group of first pads.