Adjusting eddy current measurements
US9636797B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2014 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Aug 3, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Among other things, a method of controlling polishing during a polishing process is described. The method includes receiving a measurement of a thickness, thick(t), of a conductive layer of a substrate undergoing polishing from an in-situ monitoring system at a time t; receiving a measured temperature, T(t), associated with the conductive layer at the time t; calculating resistivity ρT of the conductive layer at the measured temperature T(t); adjusting the measurement of the thickness using the calculated resistivity ρT to generate an adjusted measured thickness; and detecting a polishing endpoint or an adjustment for a polishing parameter based on the adjusted measured thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.