Patent · US Active

Carrier system for processing semiconductor substrates, and methods thereof

US9640419B2 · kind B2 · utility

0Cited by

7References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Schneegans · Vaterstetten, DE
Martin Mischitz · Wernberg, AT
Michael Roesner · Villach, AT
Michael Pinczolits · Villach, AT

Key dates

Filing date	Aug 4, 2014
Grant date	May 2, 2017
Priority date	—
Expiry date	Aug 4, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In accordance with an alternative embodiment of the present invention, a method for forming a semiconductor device includes applying a paste over a semiconductor substrate, and forming a ceramic carrier by solidifying the paste. The semiconductor substrate is thinned using the ceramic carrier as a carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.