In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning

US9645097B2 · kind B2 · utility

Assignee

• KLA-TENCOR CORPORATION · US

Inventors

• Lena Nicolaides · Castro Valley, US
• Ben-ming Benjamin Tsai · Saratoga, US
• Prashant Aji · San Jose, US
• Michael Gasvoda · Los Gatos, US
• Stanley Stokowski · Danville, US
• Guoheng Zhao · Sunnyvale, US
• Youxian Wen · Livermore, US
• Mohan Mahadevan · Santa Clara, US
• Paul Horn · Milpitas, US
• Wolfgang Vollrath · Burbach, DE
• Isabella Talley Lewis · San Jose, US

Key dates

• Filing date: Jun 17, 2015
• Grant date: May 9, 2017
• Expiry date: Jun 17, 2035

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2201/06113
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.