Optical method and system for detecting defects in three-dimensional structures
US9651498B2 · kind B2 · utility
1Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2013 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Dec 25, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2201/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and system are presented for use in inspection of via containing structures. According to this technique, measured data indicative of a spectral response of a via-containing region of a structure under measurements is processed, and, upon identifying a change in at least one parameter of the spectral response with respect to a spectral signature of the via-containing region, output data is generated indicative of a possible defect at an inner surface of the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.