Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
US9653424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2014 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Oct 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention discloses a semiconductor package with adhesive material pre-printed on the lead frame and chip, and the manufacturing method. The adhesive material is applied onto the chip carrier and the pin of the lead frame and also on the front electrode of the semiconductor chip via pre-printing. The back of the semiconductor chip is adhered on the chip carrier, and the front electrode of the semiconductor chip and the pin are connected respectively with a metal connector. The size, shape and thickness of the adhesive material are applied according to different application requirements according to size and shapes of the contact zone of the semiconductor chip and the metal connector. Particularly, the adhesive zones are formed by pre-printing the adhesive material thus significantly enhance the quality and performance of semiconductor products, and improves the productivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.