Semiconductor device and method for forming the same
US9653594B2 · kind B2 · utility
6Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2016 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Feb 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/0227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for forming and using a liner is provided. An embodiment comprises forming an opening in an inter-layer dielectric over a substrate and forming the liner along the sidewalls of the opening. A portion of the liner is removed from a bottom of the opening, and a cleaning process may be performed through the liner. By using the liner, damage to the sidewalls of the opening from the cleaning process may be reduced or eliminated. Additionally, the liner may be used to help implantation of ions within the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.