Integrated circuit packaging system with plated copper posts and method of manufacture thereof
US9693455B1 · kind B1 · utility
6Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2014 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Mar 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0733
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method of manufacture of an integrated circuit packaging system includes: a copper film; a first metal layer directly on the copper film; an insulation layer directly on and over the first metal layer, the insulation layer having a via hole through the insulation layer; a conductive via within the via hole and directly on the first metal layer; a second metal layer directly on the conductive via and the insulation layer; a copper post directly on the copper film; a solder pad over the copper post; and an interposer coupled to the copper post and the solder pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.