System and method for flux coat, reflow and clean
US9694436B2 · kind B2 · utility
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23References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 3, 2014 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Apr 23, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.