Heated substrate support with temperature profile control
US9698074B2 · kind B2 · utility
6Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2014 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | May 15, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus of substrate supports having temperature profile control are provided herein. In some embodiments, a substrate support includes: a plate having a substrate receiving surface and an opposite bottom surface; and a shaft having a first end comprising a shaft heater and a second end, wherein the first end is coupled to the bottom surface. Methods of making a substrate support having temperature profile control are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.