Fen Yu
6Patents
1h-index
22Co-inventors
47Inventor score
Filing activity: May 18, 2011 → Feb 1, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9704797B2 | Waterfall wire bonding | Electricity | 8 | Active |
| US11810896B2 | Substrate component layout and bonding method for increased package capacity | Electricity | 0 | Active |
| US11784135B2 | Semiconductor device including conductive bumps to improve EMI/RFI shielding | Electricity | 0 | Active |
| US11488883B1 | Semiconductor device package having thermally conductive layers for heat dissipation | Electricity | 0 | Active |
| US12027497B2 | Semiconductor device with unbalanced die stackup | Electricity | 0 | Active |
| US12154860B2 | Method of forming a semiconductor device including vertical contact fingers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.