Apparatus for wetting pretreatment for enhanced damascene metal filling
US9721800B2 · kind B2 · utility
5Cited by
57References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2014 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Feb 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.