Patent · US Active

Apparatus for wetting pretreatment for enhanced damascene metal filling

US9721800B2 · kind B2 · utility

5Cited by
57References
32Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 9, 2014
Grant dateAug 1, 2017
Priority date
Expiry dateFeb 8, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76898
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.