Wafer processing equipment having exposable sensing layers

US9725302B1 · kind B1 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Leonard Tedeschi · San Jose, US
• Lili Ji · Nanjing, CN
• Olivier Joubert · Meylan, FR
• Dmitry Lubomirsky · Cupertino, US
• Philip Allan Kraus · San Jose, US
• Daniel T. McCormick · Richmond, US

Key dates

• Filing date: Aug 25, 2016
• Grant date: Aug 8, 2017
• Expiry date: Aug 25, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C1/00412
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.