Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer
US9728440B2 · kind B2 · utility
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1References
9Claims
0Family size
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Key dates
| Filing date | Oct 28, 2014 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Apr 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for processing a semiconductor wafer where an opaque layer is located on a surface of a handling wafer is used so the surface of the handling wafer may be detected through optical sensors. The opaque layer may be modified, or oriented, to allow light to pass through unobstructed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.