System for non radial temperature control for rotating substrates
US9728471B2 · kind B2 · utility
3Cited by
22References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2014 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Oct 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to rotate the substrate, a sensor assembly configured to measure temperature of the substrate at a plurality of locations, and one or more pulse heating elements configured to provide pulsed energy towards the processing volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.