Patent · US Active

Strip testing of semiconductor devices

US9728492B1 · kind B1 · utility

2Cited by

4References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thiong Zhou See · Melaka City, MY
Wee Boon Tay · Melaka City, MY
Lay Yeap Lim · Bukit Mertajam, MY

Key dates

Filing date	May 24, 2016
Grant date	Aug 8, 2017
Priority date	—
Expiry date	May 24, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A strip of semiconductor devices includes a plurality of leadframes electrically isolated from each other, a plurality of semiconductor chips, and an encapsulation material. Each leadframe has a first surface and a second surface opposite to the first surface. At least one semiconductor chip of the plurality of semiconductor chips is electrically coupled to the first surface of each leadframe. The encapsulation material encapsulates each semiconductor chip and at least portions of each leadframe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.